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Reverse Flow vs Forward Flow Coolant Systems in BTA Drilling

The difference between forward flow and reverse flow coolant in BTA drilling is not merely a matter of plumbing. It determines whether you need a dedicated machine with a pressure head or can run on a standard lathe, whether you achieve IT7 or IT11 tolerances, and whether chip evacuation remains reliable at the far end of a 3-meter bore.

Overview

BTA deep hole drilling uses two distinct coolant delivery architectures. The forward flow (STS/Single Tube System) is the original BTA configuration, delivering coolant externally through the annular gap between the drill tube and the bore wall. The reverse flow (ejector/DTS/Double Tube System) is a later development that delivers coolant through concentric tubes and uses a venturi to create suction for chip evacuation.

ParameterForward Flow (STS/BTA)Reverse Flow (Ejector/DTS)
Coolant delivery pathAnnular gap between tube OD and bore wallAnnular gap between inner and outer tube
Chip evacuation pathThrough inner tube (pressure-driven)Through inner tube (vacuum-assisted)
Sealing requirementPressure head (BOZA) against workpieceNone (self-contained system)
Machine compatibilityDedicated BTA machinesConventional lathes and machining centers
Diameter range7.76–2,000 mm (typical 16–700 mm)18–250 mm
Tolerance capabilityIT7–IT9IT9–IT11
Cutting performanceHigher (full tube cross-section for chip evacuation)Lower (reduced chip passage cross-section)
Coolant pressureHigh (3–10 MPa / 435–1,450 psi)Moderate (1–4 MPa / 145–580 psi)
Chip evacuation reliabilityExcellentGood (with ejector assist)
Minimum pilot holeNot required (bushing in BOZA)Required in some configurations

Forward Flow: STS/BTA System

Operating Principle

In the forward flow system, coolant is supplied through a pressure head unit called a BOZA (Bohrölzuführungsarmatur — drilling oil supply fitting) that seals against the workpiece face. The coolant travels forward through the annular space between the outer diameter of the drill tube and the wall of the drilled hole.

Coolant path:  Pump → BOZA → Annular gap (tube OD to bore wall) → Cutting face
Chip path:     Cutting face → Chip mouth → Inner tube → Machine spindle → Filtration

Components

ComponentFunctionCritical Requirements
BOZA (pressure head)Seals against workpiece, introduces coolant around the tubeConical seal surface, centering accuracy, pressure rating
Drill tubeTransmits torque and thrust, conducts chips internallyStraightness, internal surface finish for chip flow
Drill headCutting inserts, guide pads, chip mouth openingsChip mouth size affects chip size limits
Coolant pumpProvides pressure and flow for chip evacuation3–10 MPa, flow matched to diameter
Rotary unionTransfers coolant to rotating spindleLeak-free at operating pressure

Coolant Flow Path Detail

Forward flow coolant follows this path:

  1. Pump discharge — High-pressure coolant pump delivers oil at 3–10 MPa
  2. Rotary union — Transfers coolant from stationary supply to rotating machine spindle
  3. BOZA entry — Coolant enters the pressure head, which seals against the workpiece face
  4. Annular gap — Coolant flows forward through the gap between the drill tube OD and the bore wall
  5. Cutting zone — Coolant reaches the cutting inserts, providing lubrication, cooling, and hydraulic chip transport
  6. Chip mouth entry — Chips are forced by coolant pressure into the chip mouth openings on the drill head
  7. Inner tube return — The chip/coolant mixture travels back through the hollow interior of the drill tube
  8. Spindle exit — Mixture exits through the machine spindle to the filtration system

Sealing Requirements

The BOZA must maintain a pressure-tight seal at the workpiece face. This requires:

RequirementSpecificationConsequence if Not Met
Workpiece face flatness< 0.1 mmCoolant leakage, pressure loss, chip evacuation failure
Seal surface concentricity< 0.05 mm TIRUneven seal wear, premature failure
BOZA pressure rating1.5× maximum system pressureSeal blowout, safety hazard
Cone centeringWithin 0.02 mm of spindle axisDrill tube misalignment, straightness error

Advantages of Forward Flow

AdvantageReason
Maximum chip evacuation cross-sectionFull inner diameter of the tube is available for chip flow
Higher cutting performanceNo restriction on torque transmission or chip passage
Better tolerance capabilityIT7–IT9 achievable, tighter than ejector system
Larger diameter rangeUp to 2,000 mm possible
More reliable chip evacuationPressure-driven rather than vacuum-assisted
Suitable for difficult materialsPositive chip evacuation handles stringy chips

Reverse Flow: Ejector/DTS System

Operating Principle

In the reverse flow (ejector) system, coolant is delivered through a double tube — an inner tube inside an outer tube. The coolant flows forward through the annular gap between the two tubes, and chips return through the inner tube. A venturi nozzle creates suction at the chip mouth to assist chip evacuation.

Coolant path:  Pump → Spindle connector → Annular gap (inner tube OD to outer tube ID) → 
               Drill head → Partial flow through lateral outlets → Cutting face
               Partial flow through ring nozzle → Ejector (suction generation)
Chip path:     Cutting face → Chip mouth → Inner tube (vacuum-assisted) → Ejector → Filtration

Components

ComponentFunctionCritical Requirements
Spindle connectorTransfers coolant to rotating double-tube systemNon-rotating for lathes, rotating for machining centers
Outer tubeTransmits torque and thrustStraightness, torsional rigidity
Inner tubeConducts chips, forms annular coolant passageWear resistance (chip contact), internal diameter
Drill headCutting inserts, guide pads, lateral coolant outletsOutlet size and position for effective chip flushing
Ring nozzleCreates venturi effect (ejector)Nozzle gap dimensions, positioning accuracy
Coolant pumpProvides pressure and flow1–4 MPa, lower than forward flow

The Ejector Effect

The key innovation of the reverse flow system is the ejector effect, which creates suction at the chip mouth without moving parts:

  1. Approximately 2/3 of the coolant flows through the lateral outlets on the drill head, flushing chips from the cutting zone
  2. The remaining 1/3 of the coolant is directed through a ring nozzle at the rear of the inner tube
  3. The ring nozzle creates a venturi: high-velocity coolant exiting the nozzle reduces pressure in the inner tube
  4. The resulting vacuum (typically 0.1–0.3 MPa below atmospheric) pulls chips and coolant back through the inner tube
  5. The combined flow exits the system at the spindle end
Ejector ParameterTypical ValueEffect
Nozzle gap0.5–2.0 mmSmaller gap = stronger suction but higher pressure loss
Nozzle velocity20–40 m/sHigher velocity = stronger venturi effect
Suction pressure0.1–0.3 MPa below atmosphericLimited by coolant supply pressure
Bypass ratio (ejector/total flow)25–40%Higher ratio = stronger suction, less cooling at cutting edge

No Sealing Required

The ejector system is self-contained — coolant circulates entirely within the double-tube assembly. No BOZA or workpiece seal is needed. This is the defining advantage of the reverse flow system:

BenefitImplication
Use on conventional machinesCan run on standard lathes and machining centers
Quick setup changeoverNo pressure head to install or align
No workpiece face preparationNo need for flat, concentric seal surface on the workpiece
Reduced workpiece handlingPart can be drilled on the same machine used for turning or milling
Lower capital investmentExisting machines can be adapted

Limitations of Reverse Flow

LimitationCauseMitigation
Reduced chip evacuation cross-sectionInner tube occupies space inside outer tubeLimit depth and material removal rate
Larger minimum diameterDouble tube requires space for both tubesMinimum ~18 mm bore
Looser tolerances (IT9–IT11)Lower torsional rigidity of double tubeUse for applications where IT9 is acceptable
Lower cutting performanceReduced chip flow capacityReduce feed rate, increase number of passes
Not suitable for very deep holesEjector effect weakens with depthLimit to L/D < 80:1

Coolant Flow Path Comparison

Path Schematic

SegmentForward Flow (STS)Reverse Flow (Ejector)
Pump to machineExternal high-pressure pipingExternal piping
Machine to toolThrough spindle and BOZAThrough spindle connector
Forward pathAnnular gap between tube OD and bore wallAnnular gap between inner and outer tube
Cutting zoneDirect impingement on cutting edgesThrough lateral outlets + ring nozzle
Return pathThrough inner tube (full ID)Through inner tube (reduced ID by venturi)
Chip transport mechanismPressure-driven (positive)Vacuum-assisted (ejector)

Hydraulic Characteristics

ParameterForward FlowReverse Flow
Supply pressure3–10 MPa (435–1,450 psi)1–4 MPa (145–580 psi)
Flow rate per mm diameter2–5 L/min per mm of bore diameter1.5–3 L/min per mm of bore diameter
Pressure at cutting edge60–80% of supply pressure40–60% of supply pressure
Chip transport velocity5–10 m/s3–6 m/s
Temperature rise in coolant5–15°C above ambient8–20°C above ambient
Filtration requirement10–20 µm20–30 µm

Chip Evacuation Mechanism

Forward Flow Chip Transport

In the forward flow system, chips are evacuated by positive pressure:

AspectDescription
Driving forceCoolant pressure differential (high at cutting zone, low at exit)
Chip entryCoolant flow forces chips into chip mouth openings on the drill head
Chip travelFree flow through the full cross-section of the inner tube
Velocity5–10 m/s, sufficient for all chip types
ReliabilityHigh — pressure-driven flow is not affected by depth
LimitationPressure loss increases with depth; may limit maximum L/D

The chip mouth openings on the drill head are sized to admit broken chips but block oversized fragments. Typical chip mouth dimensions:

Bore DiameterChip Mouth WidthMaximum Chip Size
20 mm6–8 mm5 × 5 × 2 mm
40 mm10–14 mm8 × 8 × 3 mm
80 mm18–25 mm15 × 15 × 4 mm
160 mm30–45 mm25 × 25 × 5 mm

Reverse Flow Chip Transport

In the ejector system, chip evacuation relies on a combination of pressure and vacuum:

AspectDescription
Driving forceLateral coolant flow (pushes) + venturi suction (pulls)
Chip entryLateral coolant outlets flush chips from cutting zone toward chip mouth
Chip travelThrough inner tube, assisted by suction from ejector nozzle
Velocity3–6 m/s, lower than forward flow
ReliabilityGood for moderate depths, degrades at extreme L/D
LimitationInner tube cross-section is reduced by the double-wall design

Warning — The ejector effect weakens at depths beyond approximately 80× diameter. For very deep holes (L/D > 100:1), the forward flow system provides more reliable chip evacuation because the pressure-driven transport does not depend on suction that must propagate the full length of the tube.

Pressure Requirements and Hydraulics

Forward Flow Pressure Profile

The pressure in a forward flow system drops along the flow path:

LocationPressure (Typical)% of Supply
Pump discharge3–10 MPa100%
Rotary union exit2.8–9.5 MPa95%
BOZA entry2.7–9.2 MPa92%
Cutting zone1.8–7.0 MPa60–80%
Chip mouth entry0.5–3.0 MPa20–40%
Tube exit0.1–0.5 MPa5%
Filtration inletAtmospheric0%

The pressure loss in the annular gap is a function of:

  • Gap size (bore diameter minus tube OD) — smaller gaps create higher pressure loss
  • Tube length — longer tubes increase friction loss
  • Coolant viscosity — higher viscosity increases loss
  • Flow rate — loss increases with the square of flow rate

Reverse Flow Pressure Profile

LocationPressure (Typical)% of Supply
Pump discharge1–4 MPa100%
Spindle connector exit0.9–3.8 MPa95%
Annular gap entry0.85–3.6 MPa90%
Lateral outlets0.3–1.5 MPa30–40%
Cutting zone0.2–1.0 MPa20–30%
Ring nozzle (ejector)0.5–2.0 MPa50%
Inner tube (at chip mouth)0–0.3 MPa below atmosphericVacuum

Pump Selection

ParameterForward FlowReverse Flow
Pump typePositive displacement (screw or piston)Centrifugal or positive displacement
Pressure ratingUp to 10 MPaUp to 4 MPa
Flow controlVariable flow preferred for chip evacuation controlFixed flow acceptable
Filtration10–20 µm absolute20–30 µm absolute
Coolant typeOil-based (HFD or similar)Oil-based or emulsion

Machine Compatibility and Integration

Forward Flow Machine Requirements

RequirementDetail
Machine typeDedicated BTA deep hole drilling machine
Spindle configurationHollow spindle for chip passage
Pressure head (BOZA)Integrated into machine structure
Coolant systemHigh-pressure (3–10 MPa), high-flow
Guide bushingIntegrated into BOZA or machine headstock
Chip collectionThrough-spindle chip chute and conveyor
Workpiece handlingMust accommodate BOZA sealing interface

Suitable applications: high-volume production, difficult materials, deep holes (L/D > 80:1), tight tolerance requirements.

Reverse Flow Machine Requirements

RequirementDetail
Machine typeConventional lathe, machining center, or BTA machine
Spindle configurationStandard spindle with coolant-through capability
Pressure headNot required
Coolant systemModerate pressure (1–4 MPa), standard coolant-through
Guide bushingRequired in workholding fixture
Chip collectionThrough-spindle or through-turret connection
Workpiece handlingStandard workholding (chuck, faceplate)

Suitable applications: retrofit applications, moderate depths (L/D < 80:1), multi-operation parts, lower volume production.

Retrofit Considerations

The reverse flow (ejector) system was developed specifically to enable deep hole drilling on conventional machine tools. Key retrofit considerations:

ConsiderationRequirement
Spindle coolant-throughMinimum 1 MPa at required flow rate
Tool holder interfaceCustom connector for turret or spindle
Guide bushing holderMust fit tool turret or spindle adapter
Coolant filtrationUpgrade to 20–30 µm for deep hole drilling
Chip managementChip conveyor may need upgrade for volume
CNC programPeck drilling cycle not required; single-pass feed

Application-Specific Selection

Select Forward Flow (STS/BTA) When

ConditionReason
Hole diameter > 250 mmEjector system limited to 250 mm max
Required tolerance IT7–IT9Forward flow provides tighter tolerances
L/D ratio > 80:1Forward flow chip evacuation more reliable at extreme depth
Difficult-to-machine materialPositive chip evacuation handles stringy, tough chips
High production volumeHigher cutting performance = shorter cycle times
Dedicated machine availableBOZA integration is straightforward
Bore length > 3,000 mmPressure-driven chip transport maintains velocity

Select Reverse Flow (Ejector/DTS) When

ConditionReason
Drilling on conventional machineNo pressure head required
Hole diameter 18–250 mmWithin ejector system diameter range
Required tolerance IT9–IT11Ejector system tolerance capability
Multi-operation partDrill on same machine as turning/milling
Lower capital investmentNo dedicated BTA machine needed
Quick changeover between jobsNo pressure head setup time
Prototype or short-run productionLower tooling and setup cost

Diameter Range Overlap

For diameters in the overlap range (18–250 mm) where both systems can be used:

FactorForward Flow AdvantageReverse Flow Advantage
ToleranceIT7–IT9
Depth capabilityL/D > 80:1
Machine costLower capital
Setup timeFaster changeover
Material versatilityBetter chip evacuation
Retrofit potentialWorks on existing machines

Summary

ParameterForward Flow (STS/BTA)Reverse Flow (Ejector/DTS)
Coolant deliveryAnnular gap: tube OD to bore wallAnnular gap: inner to outer tube
Chip evacuationPressure-driven through inner tubeVacuum-assisted through inner tube
SealingBOZA pressure head requiredSelf-contained, no seal required
Machine typeDedicated BTA machineConventional lathe or machining center
Diameter range7.76–2,000 mm18–250 mm
ToleranceIT7–IT9IT9–IT11
Cutting performanceHigherModerate
Chip evacuation reliabilityExcellentGood (to ~80:1 L/D)
Coolant pressure3–10 MPa1–4 MPa
Setup complexityHigher (BOZA alignment)Lower (spindle connector)
Capital investmentHigherLower
Best forProduction, difficult materials, deep holesRetrofits, multi-operation, moderate depth

FAQ

What is the difference between forward flow and reverse flow coolant in BTA drilling?

Forward flow (STS/BTA) delivers coolant through the annular gap between the drill tube outer diameter and the bore wall. Coolant is pumped forward under high pressure (3–10 MPa) and chips return through the inner tube. Reverse flow (ejector/DTS) delivers coolant through the annular gap between an inner and outer concentric tube. It uses a venturi nozzle to create suction that pulls chips back through the inner tube at lower pressure (1–4 MPa), requiring no seal against the workpiece.

Which system provides better chip evacuation?

Forward flow (STS/BTA) provides more reliable chip evacuation, especially at high L/D ratios. The pressure-driven flow maintains chip transport velocity regardless of depth. The full inner tube cross-section is available for chip passage. Reverse flow (ejector/DTS) relies on suction from the venturi effect, which weakens with depth and has a reduced chip passage cross-section due to the double-tube design. For L/D ratios beyond 80:1, forward flow is the preferred choice.

Can the ejector system be used on any CNC lathe?

The ejector system can be retrofitted to most CNC lathes and machining centers with through-spindle or through-turret coolant capability. Requirements include: minimum coolant pressure of 1 MPa at the required flow rate, a spindle connector for the double-tube assembly, a guide bushing holder that fits the turret or spindle adapter, and coolant filtration to 20–30 µm. Most modern CNC machines with high-pressure coolant options meet these requirements.

What diameter range does each system cover?

Forward flow (BTA/STS) covers from approximately 7.76 mm to 2,000 mm, with typical industrial applications starting at 16 mm. Reverse flow (ejector/DTS) covers approximately 18–250 mm. Below 18 mm, the double-tube configuration cannot accommodate both the inner and outer tubes with sufficient cross-section for chip flow. Above 250 mm, the ejector effect becomes less effective and the stiffness advantage of the single-tube forward flow system dominates.

Why does the ejector system not require a pressure head?

The ejector system is self-contained — coolant circulates entirely within the double-tube assembly. The outer tube contains the coolant flow, and the inner tube conducts chips. No sealing against the workpiece is needed because coolant never contacts the bore wall at high pressure. In contrast, the forward flow system delivers coolant through the annular gap between the tube and the bore wall, which requires a seal (BOZA) at the workpiece entry point to prevent coolant from escaping.

Which system achieves tighter tolerances?

Forward flow (STS/BTA) achieves tighter tolerances: IT7–IT9 compared to IT9–IT11 for the reverse flow (ejector) system. The difference is due to the higher torsional rigidity of the single tube (no inner tube reducing the effective cross-section) and the more stable cutting conditions provided by higher coolant pressure and more effective chip evacuation. The ejector system's reduced rigidity allows more vibration, which degrades concentricity.

Is the ejector system suitable for high-volume production?

The ejector system is suitable for moderate-volume production but is generally outperformed by the forward flow system for high-volume applications. The forward flow system offers higher cutting performance (higher metal removal rate), tighter tolerances (reducing or eliminating secondary operations), and more reliable chip evacuation (reducing downtime for chip clearing). The ejector system's main advantage is machine compatibility, not production speed.

What are the pressure requirements for each system?

Forward flow (STS/BTA) requires 3–10 MPa (435–1,450 psi) at the pump, depending on bore diameter, depth, and material. Reverse flow (ejector/DTS) requires 1–4 MPa (145–580 psi). The ejector system operates at lower pressure because the coolant path is entirely within the tool assembly (shorter distance, no annular gap friction loss against the bore wall). The forward flow system must overcome friction loss through the long annular gap between the tube and bore wall.

Can both systems use the same drill heads?

Drill heads for forward flow and reverse flow are structurally similar but have different coolant outlet configurations. Forward flow drill heads have coolant passages that direct flow from the annular gap to the cutting edges and chip mouth. Reverse flow drill heads have additional lateral coolant outlets on the circumference that direct flow from the inter-tube annular space to the cutting zone and chip mouth. The cutting insert geometry and guide pad layout are typically similar between the two systems.

Which system should I choose for retrofitting an existing machine?

Choose the reverse flow (ejector/DTS) system for retrofitting an existing conventional machine tool. The ejector system requires only a spindle connector, guide bushing holder, and adequate coolant supply — no pressure head or machine structure modifications. This allows deep hole drilling capability to be added to a standard CNC lathe or machining center at a fraction of the cost of a dedicated BTA machine. The trade-off is reduced cutting performance and looser tolerances compared to a dedicated forward flow system.


Coolant system selection depends on hole geometry, material, production volume, and available machine tools. The specifications in this article represent typical ranges for production BTA drilling as of 2026. Consult machine and tooling suppliers for application-specific recommendations.

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